Tempress is a global supplier of thermal processing equipment and process solutions for the semiconductor and advanced materials industries, with a long-standing focus on diffusion, oxidation, annealing and deposition technologies. Its solutions support applications across semiconductor, power electronics, MEMS, photonics and other advanced materials markets, ranging from wafer manufacturing and device fabrication to emerging applications.
With the integration of SPT Microtechnologies USA into the Tempress group in 2026, Tempress now combines its established thermal processing portfolio with SPT’s extensive vertical batch furnace technology and application expertise. The SPT portfolio includes the latest AVP Ace and RVP Ace platforms, as well as established AVP/RVP and RVP-300/RVP-550 systems, covering 150–300 mm wafer processing. These systems support a broad range of thermal processes including oxidation, diffusion, annealing, LPCVD, ALD and related deposition applications.
Tempress therefore offers a broad thermal processing platform spanning horizontal and vertical furnace configurations, with solutions designed for high uniformity, process stability, productivity and application flexibility. The combined portfolio enables Tempress to support customers from development and specialty applications through to high-volume production, with particular relevance to More-than-Moore markets such as power semiconductors, MEMS, photonics and specialty devices.
Vertical Batch Furnaces
AVP Ace
Newest release Advanced/Rapid Vertical Processor for 150mm and 200mm wafers
Superior process results
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Excellent temperature control from 100-1250C
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Advanced injector technology for optimal gas distribution
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Low O2 load lock maintains controlled wafer environment and ensures repeatability
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Uses qualified process module
Low cost of ownership
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Single or dual-boat configuration
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Modular architecture for fast move in and startup
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in process time
System flexibility
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Runs 2 wafer sizes simultaneously with no hardware changes
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Compatible with perforated, bonded and ultra-thin substrates
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Field conversion kits enable fast applications changes
RVP Ace
Newest release Rapid Vertical Processor for 200mm and 300mm wafers
Process Flexibility
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Runs 200 and 300 mm simultaneously with no hardware changes
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Compatible with bonded, thin and bowed substrates
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Advanced across-flow chamber design for enhanced process control
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Uses proven process modules
Low Cost of Ownership
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Modular architecture for fast move in and startup
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Improved automation reliability
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Minimum calibration and Preventive maintenance
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in process time
RVP-300
RVP-300plus and RVP-550 Rapid Vertical Processors for 200mm and 300mm wafers
Features:
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The RVP-300 Plus/550 is the industry’s production-proven 300mm furnace
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Superior productivity
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Full complement of APCVD and LPCVD process selections
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Designed to occupy minimal fab space
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Layout provides for multiple systems with zero side spacing required due to innovative packaging
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Excellent accessibility for maintenance from rear
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Enhanced Temperature Control
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Utilizes fast ramping element and forced air cooling
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Proprietary Advanced Temperature Control software to maximize throughput by minimizing the time to attain and cool from process temperature
AVP/RVP
AVP-8000, AVP-8200, RVP-9000, and RVP-9200 Vertical Processors for 150-200mm wafers
Features:
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Advanced/Rapid Vertical Process
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Small footprint enables side by side installation
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Low Cost of Ownership
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Single or Dual boat configuration
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Up to 200 wafer batch
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Remanufactured tools available (subject to donor availability)
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Flexible substrate handling
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150mm and or 200mm wafers
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Perforated and thin/bowed wafers
WJ-APCVD
Watkins Johnson (WJ) Atmospheric Pressure CVDs with self-cleaning, heated conveyor processing
SPT offers continued support, spares, and upgrades for Atmospheric Pressure CVD of SiH4 or TEOS based dielectrics. Our patented Watkins Johnson (WJ) linear injector technology enables precise, repeatable deposition of doped or un-doped films with no transient film properties and uniform gap fill across the wafer.
HORIZONTAL FURNACES
VS Series
Smaller Batch Processing
The VS series vertical furnace is a very economical, scalable and small footprint solution for smaller batch (up to 75 process wafers) wafer processing.
The platform offers latest technology for a wide range of diffusion, deposition and curing processes. The very flexible multi-side installation capabilities yield optimal use of your cleanroom space. With wafer handling options ranging from manual loading to fully automated with OHT, the VS series allows for easy and cost-effective integration in any environment.
TS Series V
Multipurpose Thermal Process Platform
The horizontal furnace TS series V is optimized for flexibility, multiple processes and cleanroom space. With its modular design the TS series V is available with up to four process chambers that can independently and simultaneously run a multitude of processes. The TS series V is future proof: process capabilities can be improved and extended over time with its upgradeable and configurable soft- and hardware and the wafer handling can be fully automated.
TS 12806
Fully Automated Horizontal Furnace Cluster
The horizontal furnace cluster TS 12806 is optimized for high volume production and cleanroom space. With its modular design the TS 12806 is available with up to six process chambers that can independently and simultaneously run wet oxidation/anneal processes.. The TS 12806 is future proof with its upgradeable and configurable soft- and hardware and the wafer handling can be optionally expanded with stocker functionality.
