Forge Nano, based in Thornton, Colorado, is a pioneering materials science company that develops advanced atomic layer deposition (ALD) technologies to precisely engineer material surfaces and unlock enhanced performance across industries such as energy storage, semiconductors, and advanced manufacturing. Founded in 2011 and trusted by leading industrial partners, Forge Nano is driving innovation from research-scale tooling to industrial-scale production solutions that strengthen critical infrastructure worldwide.
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Forge Nano’s semiconductor wafer fabrication equipment applies ultra-thin, atomically precise coatings that unlock higher device performance, improved yield, and advanced material integration. Engineered for high-throughput production, these systems deliver conformal coatings at lower precursor consumption, reducing cost of ownership while enabling next-generation device architectures.
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Its proprietary Atomic Armor™ platform removes constraints like thermal instability or surface degradation at the atomic level. We deliver faster-charging batteries, flawless semiconductor yields, and high-strength structural components—reinforcing the material foundations of national security to ensure the world’s most critical systems perform at scale.
Thermal Ald
THEIA
Single Chamber R&D Scale Equipment
Forge Nano’s Theia system is capable of ALD processing on single wafers from 75mm to 200mm sizes. Unique or irregular substrates are easily enabled with customization available upon request.
TEPHRA
Single chamber or cluster tool for high-volume 8" manufacturing
TEPHRA is Forge Nano’s single-wafer, thermal ALD cluster tool dedicated to high volume manufacturing of specialty semiconductor applications on 200 mm wafers and below. It is built for high throughputs, efficient chemical use and low-risk manufacturing, setting new benchmarks for thermal ALD productivity.
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Single process module (TEPHRAOne) with cassette load lock and fully automated wafer cassette processing, mainly for applications requiring a single layer or nanolaminate (moisture barriers or passivation layers)
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Cluster tool with up to 8-sided platform with up to six process modules enables highest throughput and sequential processing under vacuum minimizing cross contamination. This way, metal barrier seed in TSV can be processed on one tool with one process chamber each for oxide, nitride and metal.
