Takatori is a Japanese supplier of semiconductor manufacturing equipment with a strong focus on wafer handling, mounting, lamination and support processes for thin-wafer and advanced packaging applications. Its equipment portfolio covers a broad range of processes from wafer protection and mounting through substrate attachment and detachment, UV irradiation and film-resist lamination.
Takatori is particularly focused on applications requiring precise, low-stress handling of thin and ultra-thin wafers. Its portfolio includes wafer protective tape lamination and removal systems, wafer mounters, UV irradiation equipment, film-resist laminators and package mounting systems, with solutions available for both 8-inch and 12-inch wafers.
The company also offers equipment for advanced packaging and heterogeneous integration, including vacuum-based wafer-to-substrate bonding and debonding systems for FOWLP and HBM-related applications. Its latest developments address emerging packaging technologies such as fan-out packaging, HBM, chiplets and panel-level packaging (PLP), including vacuum laminators and equipment for larger substrates.
Takatori's semiconductor equipment is complemented by its advanced-materials processing portfolio, including multi-wire and single-wire saws and grinding equipment for Si, SiC, GaN, sapphire and other hard and brittle materials. This combination gives Takatori a broad position across wafer preparation, thin-wafer processing and advanced semiconductor packaging, with particular expertise in automated, high-precision handling and material processing.
WIRESAW AND GRINDING
MWS and WSD
Large line-up of multi wire and single wire saws
Machines developed particular about processing quality in slicing and grinding are in a line-up up to 12'' wafer processing.
Main advantages include accurate slicing and precise griding but also usability for our customer. The long-term grown fine-processing system can bring an improvement in a processing quality, a productivity and workability.
Main materials capable of slicing:
SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and any other hard brittle material.
GLP
Grinders
The models have a high rigidity structure conceived by Takatori in order to achieve an outstanding thickness accuracy in any materials, up to 8''. A capability to adapt with various grindstones can contribute to the customer’s unique griding process technology. The model also adopted to an automation, therefore to the customer’s productivity as well it can contribute.
Backend and Advanced Packaging
(De)bond, (De)tape, Frame Mount, Laminate
Takatori offers a broad portfolio of semiconductor equipment covering wafer protection, mounting, thinning and advanced packaging processes. Key product families include ATM-1100/3100 and TEAM-series systems for protective-tape and film-resist lamination, ATRM-series equipment for tape removal, and ATM-8100/8200/12000 and SAM-8 wafer mounters for thin-wafer and dicing-frame applications.
For advanced packaging, Takatori supplies WSM-100/200 and GWS/GWSM-300 systems for vacuum-based wafer/substrate attaching and detaching, including applications such as FOWLP and HBM wafer support. Its portfolio also includes TUV-series UV irradiation systems, package mounters and dry-film lamination equipment, with newer solutions targeting FOPLP, chiplet and PLP processes.
Overall, Takatori's equipment spans wafer mounting, protective-film lamination/removal, back-grinding preparation, substrate bonding/debonding, UV treatment and advanced packaging, with solutions for both 8-inch and 12-inch wafers as well as emerging panel-level applications.
Product line-up:
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Wafer protection / lamination: TEAM-100, ATM-1100G/K, ATM-3100, ATM-3000EF
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Tape removal: ATRM-2300, ATRM-2400TKUV, ATRM-4000
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Wafer mounting: ATM-8100S/X, ATM-8200A, ATM-12000DR, SAM-8
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UV treatment: TUV-1, TUV-M, TUV-12
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Wafer/substrate attach & detach: WSM-100/200, GWS-300M/R, GWSM-300M/R
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Advanced packaging / PLP: TEAM-300A/B, vacuum laminators, HBM/FOWLP and chiplet applications
