MueTec, based in Munich/Germany, develops high precision, optical measurement and inspection solutions that help customers in the semiconductor and microelectronics industry to improve their manufacturing yield and overall process control. Their technology supports wafer, reticle and MEMS manufacturers worldwide, offering customized and standard solutions at extremely low maintenance requirements.
Metrology
DaVinci Series
Metrology for overlay, critical dimension and film thickness
The DaVinci system for metrology is used for high precision overlay and critical dimensions (CD) measurement tasks. It enables customers to monitor the single manufacturing steps and derive necessary process adaptions. The combination of highest precision, throughput, best repeatability and user-friendly operation are key elements of this system. A closed frame design and fully automated operation are basic requirements for usage in high end semiconductor foundries.
Available products:
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DaVinci 300 iOVL (>90nm nodes)
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DaVinci 200 iOVL (>130nm nodes)
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DaVinci 150/200
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DaVinci 200IR/300IR for infrared metrology and inspection (sealing and device inspection)
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DaVinci 270UV for mask metrology for mask layers with feature size of >350nm
MT/IRIS Series
Open frame metrology systems
The MT/IRIS systems are the first generation of metrology and inspection tools and based on an open frame design for high flexibility and accessibility. Tool application field varies from metrology and inspection in light range from UV, visible and infrared. The tools are available in semi-automated version, typically used in semiconductor development area as well as fully automated version for production area. With the special infrared version customers are enabled to inspect silicon or GaAs wafers and other substrates with respect to sealing and device defects. Repeatability for overlay down to 4nm, repeatability of CD measurement down to 5nm (2nm for 270UV version).
Available products:
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MT 3000VIS/UV up to 8''
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MT 2010 for IR inspection of Si, GaAs and other substrates
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MT 270UV for mask size up to 9''
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IRIS 2100 leading-edge IR wafer inspection and metrology
MACRO INSPECTION
ARGOS Series
Fully-automated macro defect inspection
The ARGOS system for Macro defect inspection is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, customers are enabled to move from sample inspection to inspection of all wafers and from manual inspection by operators to a statistically reliable, automated inspection process.
Available products:
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ARGOS 200/300
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ARGOS 150HT/200HT with high throughput and small footprint
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ARGOS 200-F/300-F for post-saw framed wafer inspection (wafer, foil and frame)
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ARGOS 200-F SiC for post-saw framed wafer inspection, optimized for SiC substrates
SPECTOR Series
Mask defect inspection
The SPECTOR system for Mask defect inspection will be applicable for mask manufacturer and quality department from semiconductor manufacturer to analyze and evaluate the condition of masks and reticles. A fully automatic measurement and analysis enables the user to decide if the photomask is intact, requires cleaning or needs to be replaced. Integrated in a fully automated closed frame tool or as an open frame tool for semi-automated operation, these platforms are attractive for different market segments.
Available products:
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SPECTOR-A fully automated open frame tool for masks up to 9''
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SPECTOR-M semi-automated open frame tool for masks up to 9''
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SPECTOR 5500 fully automated closed frame tool for masks up to 14''
Rembrandt 200/300
High-resolution macro imaging
The Rembrandt system for macro imaging is developed for high resolution wafer analysis. A high-resolution camera, precision linear stages and machine vision optics are the basis for generating pictures with pixel size down to 1µm resolution. The measurement principle is moving a Wafer via x-/y-stage and take images of the whole Wafer by stitching all shots together. Application of this technology can be found in development departments of semiconductor manufacturers. Through an interactive software, the review from the complete wafer scan is intuitive and enables the user to dynamically analyze structures on substrates.
