YSystems is a supplier of Smart Solutions for the Optical Semiconductor Industry. Based in quiet Tokushima in the Shikoku prefecture in Japan, YSystems is a fast growing maker of analysis equipment. The company focus is on reliable, smart and affordable systems to match the pace and budgets of rapidly growing areas of technology such as compound semiconductor, LED, LD and solar cell makers.
Globally selling products include the YWafer Mapper series, for photoluminescence and optical thickness mapping systems in the compound semi, LED and/or laser diode industry, YWafer Inspector for compound semiconductor unpatterned inspection, and YChip Bonder for discrete die bonding in semiconductor backend manufacturing.
YWafer Mapper GS4
100x100mm area (2 to 4 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Features up to 5 pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.
YWafer Mapper RD8-WL
Robotic wafer loading equipped RD8. The clean robot may handle either 2 to 6 inch wafers (RD8-WL26) or 4 to 8 inch wafers (RD8-WL48). 200x200mm area (2 to 8 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Multiple options for pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.
YWafer Mapper RD8
200x200mm area (2 to 8 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Multiple options for pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.
YGrowthMonitor for in-situ Monitoring
YGrowthMonitor is a powerful data aquisition system adaptable to numerous hardware configurations to fit your needs.
YWafer Inspector
Wafer mapping of defects and particles using high-resolution down to sub-micron levels. Includes brightfield (BF), darkfield (DF) and phosphorescence/photoluminescence (PL) modes.
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Identifies particles, scratches, micro and hex pits, cracks, micro pipes, inclusions, stains, bumps, and PL dark/white spots.
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Used in GaN-on-Si, SiC (epitaxial wafers and substrates), GaAs, InP, etc.
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Mass production-proven with 4'', 6'', 8'' (soon 12'') SEMI standard loadports or SMIF handling.
YChip Bonder
Discrete (one-by-one) device die bonder featuring eutectic, solder and epoxy bonding systems. Bonding is enabled to hoops, clips, lead frames and strips. Different handling methods (pin, gripper, flip-chip) available besides customized methods.
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Mass backend production-proven with high throughput (up to 18,000 units per hour), available for 8'' and 12''.
