top of page
YSystems Logo.png

YSystems is a supplier of Smart Solutions for the Optical Semiconductor Industry. Based in quiet Tokushima in the Shikoku prefecture in Japan, YSystems is a fast growing maker of analysis equipment. The company focus is on reliable, smart and affordable systems to match the pace and budgets of rapidly growing areas of technology such as compound semiconductor, LED, LD and solar cell makers.

 

Globally selling products include the YWafer Mapper series, for photoluminescence and optical thickness mapping systems in the compound semi, LED and/or laser diode industry, YWafer Inspector for compound semiconductor unpatterned inspection, Mask Aligner (Projection/Proximity), Maskless Exposure System, and YChip Bonder for discrete die bonding in semiconductor backend manufacturing. 

GS4-800_2019.png

YWafer Mapper GS4

100x100mm area (2 to 4 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Features up to 5 pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.

RD8-WL-800_2018.png

YWafer Mapper RD8-WL

Robotic wafer loading equipped RD8. The clean robot may handle either 2 to 6 inch wafers (RD8-WL26) or 4 to 8 inch wafers (RD8-WL48). 200x200mm area (2 to 8 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Multiple options for pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.

RD8-CP-800_2019.png

YWafer Mapper RD8

200x200mm area (2 to 8 inch wafer) photoluminescence, epitaxial layer thickness mapping, wafer curvature measurement system and more for LED/LD, sensor materials, phosphors in R&D and production. Multiple options for pre-installed photoluminescence laser excitation sources, transmitivity, reflectivity measurement in one extremely compact design.

Web-Product-YGrowthMonitor-01.png

YGrowthMonitor for in-situ Monitoring

YGrowthMonitor is a powerful data aquisition system adaptable to numerous hardware configurations to fit your needs.

ysystems_ywafer-inspector.png

YWafer Inspector

Wafer mapping of defects and particles using high-resolution down to sub-micron levels. Includes brightfield (BF), darkfield (DF) and phosphorescence/photoluminescence (PL) modes.

​

Identifies particles, scratches, micro and hex pits, cracks, micro pipes, inclusions, stains, bumps, and PL dark/white spots.

​

Used in GaN-on-Si, SiC (epitaxial wafers and substrates), GaAs, InP, etc.

​

Mass production-proven with 4'', 6'', 8'' (soon 12'') SEMI standard loadports or SMIF handling.

MA Series
Proximity and Projection Mask Aligner

ysystems_dnk_ma-4301ml.png
  • Proprietary high-speed image processing technology enables precise mask-to-wafer alignment.

  • Installing Automatic Mask Changer allows the system to support Mask Library.

  • Non-Contact Pre-Aligner achieves high-precision loading without damaging the wafer.

  • A parallelism correction mechanism achieves highly accurate control of the proximity gap between the mask and  the wafer.

  • Proprietary mirror optical system integrated into Lamp House enables high uniformity and high irradiance across the exposure area.

MX Series
Maskless Exposure System

ysystems_dnk_mx-1201.png
  • Direct imaging exposure is applicable to experimentation, research, prototype, small-lot production, or etc.

  • Applicaple to products such as semiconductors, electronic components, screen mask, metal mask, high-end PCB, high-density packaging, MEMS and FPDs.

  • No photomask is needed in the lithography process, which minimizes development cost and time lag to the market.

  • Also, custom system composition is available to meet the customers’ requests.

ysystems_ychip-bonder.png

YChip Bonder

Discrete (one-by-one) device die bonder featuring eutectic, solder and epoxy bonding systems. Bonding is enabled to hoops, clips, lead frames and strips. Different handling methods (pin, gripper, flip-chip) available besides customized methods.

​

Mass backend production-proven with high throughput (up to 18,000 units per hour), available for 8'' and 12''.

Need more details? Contact us!

We are here to assist. Contact us by phone or email.

CONTACT
Copyright merconics GmbH & Co. KG | 2026
semi_logo
vdi_logo
ivam_logo_gross.png
oea-logo-farbig-300x200.png
LI-In-Bug.png
bottom of page