Suzhou Delphi Laser is a Chinese supplier of high-precision laser micromachining equipment for semiconductor, electronics and advanced manufacturing applications. Its semiconductor portfolio covers laser-based wafer and device processing including dicing, grooving, scribing, marking, drilling, edge trimming, debonding and laser annealing, with solutions for silicon, SiC, GaAs, lithium tantalate, lithium niobate and glass.
Delphi Laser has a particular focus on third-generation semiconductors and advanced packaging, offering equipment for SiC ingot slicing, wafer processing, TGV drilling, low-k grooving, laser debonding and laser-assisted welding. Its broader portfolio also includes laser cutting and processing solutions for displays, electronics and photovoltaics.
LASER REMOVAL AND SEPARATION
Delphi Laser offers a variety of standalone or integrated laser processing systems for micromachining of a wide range of semiconductor materials. Main advantages include:
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Laser-based material removal, cutting & separation
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Pulsed UV / ultrafast lasers for precise, localized energy delivery (own laser sources)
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Selective modification, ablation or separation with minimal mechanical force
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Non-contact processing of hard, brittle and thin materials
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Integrated laser, optics, motion control and automation
Available processes:
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Slicing: SiC, GaN, Ga₂O₃, LiTaO₃, LiNbO₃
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Dicing: full cut, notch cut, stealth dicing, Taiko ring
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Scribing/grooving: wafer scribing, low-k grooving
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Drilling: TGV, TSV, TMV
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Etching: selective material removal
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Film removal: selective removal of films/coatings
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Cleaning: BEOL
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Trimming: BEOL and WLP
LASER Annealing, Marking & DeBonding
Delphi Laser offers a variety of standalone or integrated laser processing systems for micromachining of a wide range of semiconductor materials. Main advantages include:
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Laser-induced modification of semiconductor materials and surfaces
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Localized laser energy enables controlled thermal or structural modification
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Non-contact processing with digitally controlled energy and positioning
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Integrated automation for wafer and package handling
Available processes:
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Annealing: SiC/GaN (backside) activation
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Debonding: release of temporary bonded wafer
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Marking: wafer- and package level
Support processes for integration:
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Mechanical cleaving
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Tape expansion
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Tape removal/mounting
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Adhesive residue removal
