TECHNOLOGIES
Technology Portfolio
We offer innovative equipment for microelectronics manufacturing from lab to fab, both for semiconductor frontend and backend production as well as hybrid electronics.
Metrology & Inspection
Overlay & CD Control
Deposition & Patterning
Removal & Separation
Modification & Handling
Fab Infrastructure
Carrier Cleaning (Cassettes & PODs)
Reticle Automation (Stockers & Buffers)
Environmental Control (Air Handlers)
Hybrid Electronics
Semiconductor Market Coverage
We serve the major semiconductor market segments and offer cutting-edge equipment to meet the increasingly complex manufacturing requirements.
Logic & Memory
Overlay & CD Control, BF/DF Defect Inspection, Warpage, Unpatterned Wafer Inspection
ALD, PECVD/LPCVD/APCVD (oxides/nitrides), EHD
Plasma Etch, Wafer Thinning
Vertical Furnaces (Diffusion, Annealing & Oxidation), Debond, Detape, Mount & Laminate, Die Bonder
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
MEMS & Sensors
Overlay & CD Control, Warpage, BF/DF Particle Inspection, Unpatterned Wafer Inspection
PECVD/APCVD/LPCVD (Sacrificial & Structural Layers), ALD (Conformal Coating), EHD
Plasma (Si DRIE) & Wet (Sacrificial Layer) Etch
Vertical Furnaces (Oxidation, Annealing), Bond/Debond, Laminate, Die Bonder
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
Power
Defect Inspection, Wafer Bow/Stress, CL, PL, Unpatterned Wafer Inspection
ALD for dielectrics, PECVD/LPCVD for passivation & oxides, EHD
Grind, Saw & CMP, Plasma Etch for trench isolation
Vertical Furnaces (Dopant Annealing), Debond, Detape & Laminate, Die Bonder
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
Advanced Packaging
BF/DF for Bump Defects, Warpage, 3D/TSV Etch Pattern Defects
ALD and PECVD for Dielectric Layers, EHD for underfill or TGV fill/repair
Wafer Thinning, Plasma Etch (RDL vias, TSVs. cavities)
Debond, Detape, Mount & Laminate
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
Compound Semi
PL/CL (dislocation density), Deflectometry, Overlay & CD Control, BF/DF for epi defects, Unpatterned Wafer Inspection
ALD for passivation/barriers, EHD
Plasma Etch, SiC Wafer Slicing
Vertical Furnaces for Annealing & Diffusion (GaAs or GaN, e.g.), Debond, Detape, Mount & Laminate, Die Bonder
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
Optoelectronics
PL/CL (LED Epi Quality), BF/DF (Scratches & Cracks in LEDs), Unpatterned Wafer Inspection
PECVD (OLED Encapsulation), EHD for μLED repair
Plasma Etch, Multiwire Saw (Sapphire/GaN)
Vertical Furnaces (Anneal for LED Stress Relief), Laminate (OLED Stack Formation), Die Bonder
FOUP/POD Cleaning, Reticle Automation, Air Handlers, Trace Gas Analysis
