TECHNOLOGIES
Technology Portfolio
We offer innovative equipment for microelectronics manufacturing from lab to fab, both for semiconductor frontend and backend production as well as hybrid electronics.
Metrology & Inspection
Overlay & CD Control
Modification & Handling
Rapid Thermal Processing (RTP) & Photonic Debonding
(De)bond, (De)tape, Mount & Laminate
Horizontal Furnaces (Annealing, Diffusion)
Vertical Furnaces (Annealing, Diffusion)
Deposition & Patterning
Fab Infrastructure
Removal & Separation
Hybrid Electronics
Semiconductor Market Coverage
We serve the major semiconductor market segments and offer cutting-edge equipment to meet the increasingly complex manufacturing requirements.
Logic & Memory
Overlay & CD Control, BF/DF Defect Inspection, Warpage, Unpatterned Wafer Inspection, IC Test
ALD, PECVD, LPCVD/APCVD (oxides/nitrides), Mask Aligner & Direct Write, EHD, ECR Sputter, Track (Coat & Develop)
Laser Dicing, Slicing, Drilling & Scribing, Plasma Etch, CMP, Wafer Thinning
Vertical Furnaces (Diffusion, Annealing & Oxidation), Laser Annealing, Marking & Debonding, Debond, Detape, Mount & Laminate, Die Bonder, RTP
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
MEMS & Sensors
Overlay & CD Control, Warpage, BF/DF Particle Inspection, Unpatterned Wafer Inspection, IC Test
PECVD, APCVD/LPCVD (Sacrificial & Structural Layers), ALD (Conformal Coating), Mask Aligner & Direct Write, EHD, ECR Sputter, Track (Coat & Develop)
Laser Dicing, Slicing, Drilling & Scribing, Plasma (Si DRIE) & Wet (Sacrificial Layer) Etch, CMP
Vertical Furnaces (Oxidation, Annealing), Laser Annealing, Marking & Debonding, Bond/Debond, Laminate, Die Bonder, RTP
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
Power
Defect Inspection, Wafer Bow/Stress, CL, PL, Unpatterned Wafer Inspection, IC Test
ALD for dielectrics, PECVD/LPCVD for passivation & oxides, Mask Aligner & Direct Write, EHD, ECR Sputter, Track (Coat & Develop)
Laser Dicing, Slicing, Drilling & Scribing, CMP, Grind & Saw, Plasma Etch for trench isolation
Vertical Furnaces (Dopant Annealing), Laser Annealing, Marking & Debonding, Debond, Detape & Laminate, Die Bonder, RTP
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
Advanced Packaging
BF/DF for Bump Defects, Warpage, 3D/TSV Etch Pattern Defects, IC Test
ALD and PECVD for Dielectric Layers, Mask Aligner & Direct Write, EHD for underfill or TGV fill/repair, Track (Coat & Develop)
Wafer Thinning, Laser Dicing, Slicing, Drilling & Scribing, CMP, Plasma Etch (RDL vias, TSVs. cavities)
Laser Marking & Debonding, Debond, Detape, Mount & Laminate, Photonic Debonding
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
Compound Semi
PL/CL (dislocation density), Deflectometry, Overlay & CD Control, BF/DF for epi defects, Unpatterned Wafer Inspection, IC Test
ALD for passivation/barriers, Mask Aligner & Direct Write, EHD, ECR Sputter, Track (Coat & Develop)
Plasma Etch, SiC Wafer Slicing, CMP, Laser Dicing, Slicing, Drilling & Scribing
Vertical Furnaces for Annealing & Diffusion (GaAs or GaN, e.g.), Laser Annealing, Marking & Debonding, Debond, Detape, Mount & Laminate, Die Bonder, RTP
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
Optoelectronics
PL/CL (LED Epi Quality), BF/DF (Scratches & Cracks in LEDs), Unpatterned Wafer Inspection, IC Test
PECVD (OLED Encapsulation), Mask Aligner & Direct Write, EHD for μLED repair, ECR Sputter
Plasma Etch, Laser Dicing, Slicing, Drilling & Scribing, Multiwire Saw (Sapphire/GaN), CMP
Vertical Furnaces (Anneal for LED Stress Relief), Laser Annealing, Marking & Debonding, Laminate (OLED Stack Formation), Die Bonder, RTP
Chemical Supply/Automation, Hydrogen Generator, FOUP/POD Cleaning, Reticle Automation, Air Handlers
