A unique integrated platform combining wafer geometry, nano-topography, film thickness, bonding metrology and surface inspection within a seamless measurement workflow.

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All measurements are acquired on the same platform, intrinsically co-registered and analyzed within a unified software environment. By eliminating data correlation across multiple tools, VISION 300 accelerates process development, improves process control and enables faster, more confident manufacturing decisions.

D-Surface View is intended to analyze flat surfaces up to 300-mm diameter. The equipment can be used for example for wafer surface quality control, it qualifies surface roughness, shape, flatness, warpage and nano-topography, other applications can be automotive mirrors or optical components. D-Surface View provides a FULL SURFACE warpage measurement in one single acquisition. Users can extract critical parameters such as Bow, Warp, TTv, LTv in a few seconds.

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D-Surface View can explore Nano-topography characteristics and detect polishing inhomogeneities or other nanometer height defects. With powerful Fourier transform filters users can visualize short frequency and high frequency defect patterns.

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Data analytics on a large range of measurement: in one single high resolution image and pure static acquisition D-Surface View can extract from mm level down to nm level in a few seconds, users can explore the full field image at the required resolution and process through Data Analytics algorithms and Open data formats.

 

Technical Specifications: 

• 2D and 3D step heights, 2D profiles and 3D views of the measurements, 2D and 3D roughness and waviness analysis, 2D and 3D filtering and leveling techniques, Thin film stress and sample bow calculation.

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