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Nextin is a global leading company in the fields of process defect detection and metrology with its proprietary technology and development of innovative ideas in semiconductor and display industries.


With its superior defect detection technology and metrology solutions for its world-wide customers, Nextin is helping its users achieve early process stabilization from the initial R&D phase and maximize their profits during mass production.


Nextin’s headquarters is in Dongtan, Hwasung, Korea and its Software Development Center is in the Technical Golden Triangle in Israel to provide high-quality solutions and technical support to its global customers.


Laser-based Patterned Wafer Defect Inspection Tool

AEGIS Series, based on Nextin’s innovative 2-D imaging technology, detects various-types of 1x-nm node semiconductor processing defects with high sensitivity and high speed, enabling the customers’ initial process stabilization and improvement of fab yields, making it one of the most cost-effective high-performance wafer inspection systems.

Nextin’s simultaneous inspection of Bright-field and Dark-field illuminations and its patent-awarded Dual Mirror Focus Plane Assembly Technology makes high-sensitivity inspections at the fastest speeds. By supporting both 200mm and 300mm wafer sizes, AEGIS wafer inspection systems can help customers with various manufacturing applications.

AEGIS wafer inspection systems can detect not only the pattern defects like bridges, thinning, protrusion, and footing, but also scratches and particles in film, pattern-generation, planarization, ion implantation, and cleaning processes across all semiconductor manufacturing sequences, resulting in superior return on investment for its customers.


Defect Inspection solution for 3D device processes

IRIS, the Wafer Metrology-Inspection system, is utilizing Nextin’s patent-awarded technology called Multiple Off-focus Image Process Technology to measure the vertical structures and find pattern defects during the HAR process steps in 3D semiconductor devices, as well as TSV processing in the Advanced 3D Packaging processes.

Applications include TSV Etch, 3D NAND High-Aspect-Ratio Etch and Advanced 3D Package Etch.


Integrated inspection system module

TWINS is an integration module to be installed onto the process equipment to measure the edge trimming processes and inspect its process defects.

During the current semiconductor production, after the Edge Trimming step, a separate stand-alone optical inspection system is required to inspect defects like cracks and chips. To prevent and solve the problems of manufacturing delay, cost increase, and random sampling test issue, TWINS is integrated onto the Edge Trimming process systems to monitor their edge trimming performance and detect the DOI’s (Defects of Interest) like cracks, and chips to continuously warrant the Edge Trimming process results real-time.

Applications include real-time measurement of edge trimming amounts, detection of crack and chips during the edge trimming process step as well as wafer Edge inspection.

Cube Scan Technology

With its Multiple Off-focus 3D Image Comparison Technology, Cube Scan Technology overcame the traditional optical resolution limitations and now it can not only measure the nanometer-level CD patterns, but also detect the hard-to-see defects inside the HAR (High Aspect Ratio) patterns. Cube Scan Technology is applicable on both AEGIS and IRIS platforms.

Applications are Profile Measurement for FinFET Structure and Defect Inspection for HAR Process

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