Bruker has provided high-end technological solutions for each analytical task for more than 50 years now. Their systems cover a broad spectrum of applications in all fields of research and development and are used in all industrial production processes for the purpose of ensuring quality and process reliability.


Being one of the world's leading analytical instrumentation companies, Bruker is strongly committed to further fully meet its customers’ needs as well as to continue to develop state-of-the-art technologies and innovative solutions for today's analytical questions. merconics is proud to represent Bruker's Automated AFM and X-Ray Metrology systems for the Semiconductor industry in Europe.

Automated Atomic Force Microscopy (AAFM)

InSight CAP

Bruker’s InSight CAP automated atomic force profiler is specifically designed to be a combined platform for CMP and etch metrology for semiconductor manufacturers and suppliers. The InSight CAP system features 300 mm automated handling and proven GEM factory automation software.

InSight CAP provides industry-leading precision and highest resolution for CMP and Etch, non-destructive metrology that requires no models, in-line metrology results in minutes, suitable for technology development as well as  a small footprint and flexible configurations for optimum cost of ownership.

InSight AFP

Fully automated, atomic-level force control for CMP wafers

InSight AFP is the world’s highest performance CMP profiling and etch depth metrology system for advanced technology nodes. The system combines the latest innovations in atomic force microscopy, including Bruker’s proprietary PeakForce Tapping® technology, with the proven long-scan capability of an atomic force profiler. Replacing costly wafer cross-sectioning, InSight AFP monitors etch depth, dishing, and erosion on submicron features with unsurpassed repeatability.

With its radical increases in speed and accuracy,  Bruker’s fifth-generation AFP provides the industry’s highest resolution, fastest profiling, rapid 3D die mapping, and flattest profiles for submicron production. 

InSight 3D-DR

Bruker’s InSight 3D-DR system is the world’s most advanced automated 3D-DR tool for defect review. By leveraging Bruker’s extensive experience in inline-fab metrology, and combining it with exclusive PeakForce Tapping, the 3D-DR is capable of imaging nodes 7nm and below and high-speed scanning of greater than 100 images per hour. PeakForce Tapping's instantaneous force control provides enhanced imaging combined with a long probe life and a low cost of ownership, while reducing downtime for probe replacement and recalibration. FinFET process control is one of the 3D-DR’s critical applications, enabling in-die FinFET metrology and 3D defect detection, all at faster speeds than TEM and non-destructive methods.

Full 3D Capability for FinFET Metrology:

The PeakForce Tapping-enabled 3D-DR System provides full 3D capabilities in device active areas for defect characterization and FinFET metrology.

X-Ray Metrology Bruker-JV

JVX6200 series

The Bruker-JV Series (former Jordan Valley) consists of several tools for a broad spectrum of applications in both metals, WPS and device thin film and defects and CD metrology market.

JVX6200iRF: Bruker's JVX6200iRF features a multi-channel metrology platform with small spot XRF and Fast XRR channels, for measurement of thin metal layer stacks on product or blanket wafers. The tool is designed for advanced process control of metals and transparent films  at the back-end of line (BEOL), MEOL and front end of line (FEOL)  of advanced semiconductors processes (Logic, DRAM, Flash and HDD process lines).

JVX6200iF: The Bruker-JVX 6200iF Galaxy as a small spot XRF is the tool of record for single bump composition measurements. It is an XRF tool that is ideal for non-destructive, in-line µ-bump %Ag measurements. The system has a vertical excitation geometry that allows smallest beam footprint (<20µm FWHM @SnKα and AgKα) and no dependence on height variation. The tool provides information critical for good wafer level packaging process control. The JVX 6200iF comes with nEXT software which includes fully automated recipe driven measurements, FP analysis and advanced navigation algorithms allowing sub-micron centralization on single bump.

JVX7300 series

The JVX7300F is the latest generation X-ray Fluorescence (XRF) tool from Bruker. It includes all features of the JVX6200iF, which is the tool of record at many fabs, and extends the metrology capabilities for advanced micro-bump and Under Bump Metallization (UBM) processes. The JVX7300F allows the non-destructive thickness, and composition measurement,  of smaller features than previous generations of XRF tools with enhanced productivity, improved ease-of-use and maintainability.

JVX7300HR: The JVX7300HR extends the capabilities of previous High-Resolution X-ray Diffraction (HRXRD) and X-ray Reflectivity (XRR) platforms to meet advanced node challenges. JVX7300HR delivers full stack analysis with higher throughput, smaller feature dimensions, and improved tool-to-tool matching, as well as enhanced user interface, ease-of-use and lower cost of ownership (COO). The Bruker-JVX7300HR is a state of the art X-ray metrology platform, targeting the most advanced technology nodes and challenging processes, mainly of FEOL applications:

JVX7300LSI: The JVX7300LSI was designed for in-fab R&D and in-line production process monitoring of semiconductors materials. It enables fully automated characterisation of many advanced materials in the semiconductor industry. The system provides scanning HRXRD, XRR, WA-XRD for sub 20nm Si logic R&D, process development and production process monitoring on blanket and patterned wafers. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention, even within the same recipe batch. Full automation of the alignment, measurement, analysis and reporting of the results ensures productive and fast characterisation of thin films. The standard configuration is the JVX7300L, which implements Scanning HRXRD, XRR, XRD, GI-XRD and WA-XRD. To allow in-plane XRD measurements, the optional I channel can be added. For HRXRD of patterned structures, the M channel can be added (JVX7300LMI). This allows the measurement of test structures on patterned wafers, with full pattern recognition. The optional S channel is specifically designed for HRXRD of standard and advanced epitaxy on metrology pads (<100µm pads), e.g. LED or power transistor applications.


The JVSensus is the latest defect metrology system for Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra-fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.

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