Bruker has provided high-end technological solutions for each analytical task for more than 50 years now. Their systems cover a broad spectrum of applications in all fields of research and development and are used in all industrial production processes for the purpose of ensuring quality and process reliability.
Being one of the world's leading analytical instrumentation companies, Bruker is strongly committed to further fully meet its customers’ needs as well as to continue to develop state-of-the-art technologies and innovative solutions for today's analytical questions. merconics is proud to represent Bruker's Automated AFM and X-Ray Metrology systems for the Semiconductor industry in Europe.
AUTOMated AFM Metrology
A High-Performance Profiler and AFM in a Compact Form Factor
Bruker's InSight CAP automated atomic force profiler is specifically designed to be a combined platform for CMP and etch metrology for semiconductor manufacturers and suppliers. Flexible configurations to support wafer sizes from 100 mm to 300 mm enable precision measurements for a wide range of end applications. From highly productive labs to fully automated fabs the InSight CAP profiler can be optimally configured for the most cost-effective metrology solution.
Long-Term Stability and Productivity for Advanced Process Control and Development
InSight AFP is the world’s highest performance and industry preferred CMP profiling and etch depth metrology system for advanced technology nodes. The combination of its modern tip scanner with inherently stable capacitive gauges and an accurate air-bearing positioning system enables non-destructive, direct measurements in the active area of dies.
InSight CAP HP
Next-Generation Compact Atomic Profiler delivers highest value, performance, and lowest cost-of-ownership
InSight CAP HP is the world's most intuitive, easiest-to-use, cost effective Atomic Force Profiler providing the fastest time to accurate, actionable roughness, depth, profilometric and sidewall characterization data to make the in-time, process-critical decisions to enhance yield.
5NM Production Photomask repair
6th Generation AFM Guided Nanomachine
Bruker’s AFM nanomachining systems are the global standard and preferred production technique for precision repair of advanced, critical-level photomasks. The nm-VI® system is Bruker’s sixth generation AFM-Guided Nanomachine. The nm-VI sets Bruker apart as the company that can develop and deliver the innovative nano-scale material shaping processes required to keep the semiconductor industry in concert with the 5 nanometer technology node and beyond.
CRYOGENIC WAFER CLEANING
Non-Aqueos CO₂ Cryogenic Dry Cleaning
The Bruker Wafer Clean 2200 System removes particulate contamination and thin film organic residues from silicon, compound semiconductor, MEMS and thin film head substrates using a unique carbon dioxide (CO2) snow cleaning process. CO2 snow cleaning is fast, environmentally friendly and non-damaging. The all-dry process offers numerous advantages over conventional wet and plasma cleaning techniques. This fully automated, high volume production system is field proven with over 100 systems running 24/7 in high volume production applications around the globe.
X-RAY DEFECT INSPECTION
JVSENSUS-600F and SENSUS-CS
Qualify and monitor process tools at any technology node to reduce cycle times and facilitate fab expansion
The JVSensus-600F is the X-ray defect metrology system for 300mm Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.
The Sensus-CS is a high resolution XRDI system specifically designed for production monitoring of SiC. It uses a high brightness rotating anode source with a 5µm resolution detector to collect high resolution images in <30 minutes for full 150mm wafers, more than 10x faster than previous systems. The system can be equipped with full robot loading, and an optional mini-environment for full production capability. SECS-GEM software can be installed to enable full automation from the factory host.
Automated total reflection X-ray fluorescence spectrometer
Yield optimization is one of the most critical goals in semiconductor device fabrication. Trace metal contamination on the surface of silicon wafers is a major source of yield concern. Contamination control during the process is therefore essential. The JVX73000F-C is the Bruker TXRF spectrometer for full wafers and offers quick, non-destructive, in-line and completely automated trace metal measurements, enabling contamination control in device processing. The JVX7300F-C complies with SEMI standards, comes with the user-friendly FabTXRF software package and contains the latest developments in TXRF technology and tool innovation.
QC-TT and QCRT
The most comprehensive crystallographic defect inspection solution
The Bruker QC-TT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The QC-TT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer. With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically. Due to the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
The Bruker QC-RT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology in reflection mode to identify defects in high value substrates, such as CdTe and other dense materials. Due to the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
JV-DX, QC3 and QCVELOX-E
X-Ray Metrology for Compound Semiconductor
The Bruker JV-DX is the latest generation of X-ray metrology system for semiconductor thin film analysis for materials’ research, process development and quality control. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution XRD (HRXRD) and X-ray reflectivity modes without user intervention. Measurements are fully automated within recipes with the ability to also perform more esoteric measurements in semi-manual mode. An additional XRF module is available as an option for sub-100µm beam size measurements on metal films.
The QC3 is the long-established and well-proven QC system for epilayers. It is a high-resolution X-ray diffraction tool that is ideal for quality control. It is used for the measurement of composition and thickness in epitaxial layers of almost any material. The system uses standard sealed tube optics, combined with a variety of beam conditioning crystals that can be optimized to give the highest combination of resolution and intensity for each application.
The Bruker QCVelox-E is the system of choice for leading epi manufacturers to monitor their production lines. It is based on the industry standard QC3, with significant upgrades for throughput, reliability and ease of use. By using optimum X-ray source and optics technology, it couples high throughput with excellent repeatability to enable fast feedback of the layer quality and structure within a production environment.
SIRIUS and JVX7300LSI
X-Ray Metrology for Silicon Semiconductor
The Sirius-FW is a fourth generation, fully automated µXRF metrology platform that offers specialized single-bump metrology to monitor %Ag in SnAg solder bumps and under bump metalization. Its mature technology boasts a field proven uptime greater than 95%. The Sirius-FW system is capable of measuring single solder bumps as small as 10µm diameter with sub-micron positioning accuracy. Its automated intensity correction (AIC) ensures long-term stability and drift elimination. As would be expected for a production tool, the Sirius-FW is recipe driven and supports full fab automation.
The Sirius-RF is the fourth generation system in a mature platform to provide industry standard reliability, ease-of-use, fab automation, and SEMI standard compliance.
The JVX7300LSI automated diffractometer is designed for in-fab R&D and in-line production process monitoring of semiconductor materials. It enables fully automated characterization of many advanced materials in the semiconductor industry. JVX7300L is the standard configuration, which comprises Scanning HRXRD, XRR, XRD, GI-XRD and WA-XRD for strain metrology, thin film and phase analysis on blanket wafers. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention, even within the same recipe batch. Full automation of the alignment, measurement, analysis and reporting of the results ensures productive and fast characterization of thin films.
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