Revasum is a world Leader in SiC Single-Wafer Processing Equipment
Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor device manufacturing process. Their product portfolio includes grinding, polishing, and CMP equipment used to manufacture substrates and devices for the global semiconductor industry.
It’s no secret that SiC is a hard material to process. Understanding the challenges of working with SiC and applying knowledge of SiC grinding, prime wafer polishing, and CMP technology, a unique solution is developed that truly makes polishing SiC easy.
The 6EZ is the world’s first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for SiC.
Fully-automated, cassette-to-cassette handling
Single wafer processing for excellent wafer-to-wafer control
Single-side and two-sided polish
Three tables with dedicated carriers, pad conditioners, and pad cleaners
Revasum’s 7AF-HMG grinding solution extends wheel life by nine times, increases uptime by 10%, boosts wafer output by 15 percent, and reduces the cost of ownership by seven times. With a return on investment of less than one year, the choice for SiC grinding is clear: choose the 7AF-HMG.
Real-time grind performance monitoring
Supports dual fine grind, dual coarse grind, and standard coarse/fine grind processing
A self-dressing grind process
Wafer flipping available for double-side grinding applications
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