Located in Livermore, California, Yield Engineering Systems, Inc. (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers. YES designs and builds high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin film coating spanning several markets.
YES systems achieve precise surface modification and cleaning in order to increase yields and extend the life and performance of devices. YES systems are designed to meet today's most demanding process applications and provide stringent environmental control, so you get the results you want. Additionally, YES systems provide the flexibility needed by research and design engineers, while achieving the simplicity of recipe needed for the manufacturing line. Our equipment can grow with your process, from R&D to pilot line to high volume manufacturing. The Cure, Clean and Coat products are designed for a seamless Lab-to-Fab transfer.
Dielectric Vacuum Cure Ovens
The YES-PB Series manual load high temperature cure oven is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-PB Series helps achieve total environmental control to increase yields and extend device performance.
The YES-VertaCure automated, high temperature vacuum cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.
The production proven platform incorporates the laminar flow technology for low particle performance using the technology of the YES-PB series. It accommodates 200 and 300mm wafers with two or four load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 100 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.
The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:
BCB (Benzocyclobutene – Cyclotene
Plasma Cleaning and Strip/Descum Systems
YES-G1000 and YES-G500 provide five plasma modes to give engineers flexibility over their cleaning processes. Power density and capability are the same in both machines; capacity is the only difference.
YES cleaning systems utilize a low plasma generation frequency (40 kHz) to reduce chamber and product heating sometimes caused by high frequency (13.56 MHz) systems. As a result, YES systems are ideal for cleaning even electronically sensitive devices. Plasma is generated between active trays and grounded trays or chamber walls. Laminar airflow through the chamber eliminates dead spots and enhances plasma uniformity.
The YES-CV200 systems removes thick layers of photoresist or polyimide in the shortest amount of production time. Powerful plasma stripping removes tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected.
Touch screen control and real time pictorial readout of system status and maintenance requirements are standard. Process data is output to a recording computer and compiled into a Microsoft® Excel report.
Yield Engineering Systems (YES) has designed the YES-ÉcoClean as a high throughput, low-cost of ownership, single-wafer photoresist removal system. The ICP remote source generates atomic oxygen which chemically reacts with the photoresist of the wafer surface. By employing a downstream resist strip process, high removal rate is achieved with no electrical damage or defects to the substrates and devices. YES-ÉcoClean offers automated processing with low gas usage and eco-friendly "green" solution.
The inductively-coupled plasma source produces a high-density plasma that creates reactive species which flow out of the plasma chamber and down to the wafer vacuum chamber. One of the features of a remote plasma source is that charged plasma species are confined within the plasma chamber and only charge-neutral species flow from the source and interact with the substrate. Data collected from the YES-ÉcoClean shows little or no change in electrical characteristics on the monitors used in the tests.
The YES-ÉcoClean includes 2 standard mass flow controllers (3rd forming gas MFC-optional), and a 3,000 watt power source. The heated wafer chuck can be operated from 75º to 300ºC.
Vapor Deposition Coating Systems
The YES-ÉcoCoat manual batch load, vapor phase deposition system is designed for today’s leading technology products that require precise surface modification over nanoscale surface areas. Whether it’s molecular specific bonding sites for DNA microarrays or to reduce stiction for MEMS devices, the capability to use a large number of different organosilanes provides the ability for precise surface modification. Flexibility of production is assured with an optional chemical delivery system that can handle up to 3 different chemicals and 3 different gases in a precise controlled operation.
The YES-VertaCoat automated, silane vapor deposition system is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s precise surface modification to reduce stiction for MEMS devices or a thin copper diffusion barrier layer in an advanced semiconductor device, the capability to use a large number of different organosilanes provides the ability for precise surface modification. Flexibility of production is assured with an optional chemical delivery system that can handle up to 5 different chemicals in a precise controlled operation.
The YES-VertaCoat Silane Vapor System is designed for high-volume production, using an EFEM with one or two load ports and a wafer handling robot inside an integrated Class 1 minienvironment. The system incorporates the laminar flow technology of the YES-PB series. The laminar flow for the process chamber and the clean work cell environment provide the particle control required for nanoscale wafer processing.
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