Veeco/CNT is a division of the Veeco Instruments Inc. Veeco/ALD was founded in 2003, as Cambridge Nanotech, Veeco/ALD grew directly out one of the foremost atomic layer deposition (ALD) research groups in the world: the Gordon Lab at Harvard University. With hundreds of systems shipped for research and development, Veeco/ALD has become the leading ALD supplier to academic and industrial institutions worldwide. Products have been used to produce over 1000 peer-reviewed academic papers.

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Production systems are used globally for a number of different applications bringing ALD to a commercially viable solution for many customers. Whether your needs are low cost starter thermal tools, plasma enhanced systems with many integrated options and features, or a production system used 24x7, the common features are; simple user interface, quality built CE compliant platforms, Class 100 clean room compliant and all with a roadmap to meet the future ALD needs of tomorrow. Veeco/ALD pride ourselves on being on the leading edge of ALD research. Scientists and support personnel are all seasoned veterans of ALD.

Savannah

The Savannah ALD series is a compact, inexpensive ALD system for flexible R&D work. It´s ease-of-use enables scientist worldwide to develop new ALD processes for advanced applications.

Savannah has become the preferred system for university researchers worldwide engaged in ALD and looking for an affordable yet robust platform. Ultratech/CambridgeNanoTech have delivered hundreds of these systems in the past decade.

Savannah’s efficient use of precursors and power-saving features substantially reduces the cost of operating a thin film deposition system.

Savannah is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode™ for thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1.

Savannah is available in three configurations: S100, S200, and S300. Savannah is capable of holding substrates of different sizes (up to 300mm for the S300). The Savannah thin film deposition systems are equipped with heated precursors lines and the option to add up to six lines. Savannah is capable of handling gas, liquid, or solid precursors.

Fiji

The Fiji series is a modular, high-vacuum ALD system that accommodates a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The result is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition.

Ultratech/CambridgeNanoTech applied advanced computational fluid dynamics analyses to optimize the Fiji reactor, heater, and trap geometry. The system’s intuitive interface makes it easy to monitor and change recipes and processes as needed.

The Fiji is available in several different configurations, including Dual Chamber and Load Lock.

Each chamber can be configured with up to six precursor lines that can accommodate solid, liquid or gas precursors, and six plasma gas lines, offering significant experimental flexibility in a compact and affordable footprint.

Phoenix

The Phoenix is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design, plus numerous automation options, makes Phoenix the practical choice for those with batch production ALD requirements.

Key features of the Phoenix tool include precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates. Patented ALD Shield™ vapor trap helps to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment. Thelarge process chamber coats up to ten GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects.

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