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Bruker Nano Surfaces

112 Robin Hill Road
Santa Barbara, CA 93117, USA

phone: +1 805 967-1400
fax: +1 805 967-7717​



Bruker has provided high-end technological solutions for each analytical task for more than 50 years now. Their systems cover a broad spectrum of applications in all fields of research and development and are used in all industrial production processes for the purpose of ensuring quality and process reliability. Being one of the world's leading analytical instrumentation companies, Bruker is strongly committed to further fully meet its customers’ needs as well as to continue to develop state-of-the-art technologies and innovative solutions for today's analytical questions. merconics is proud to represent Bruker's Automated AFM and X-Ray Metrology systems for the Semiconductor industry in Europe.

Atomic-Force Microscopy (AFM)

peaktapping.pngBruker's industry-leading AFM microscopes provide the highest levels of performance, flexibility and productivity, and incorporate the very latest advances in atomic force microscopy techniques. These advancements include the proprietary Peak Force Tapping® technology.

csm_InSight_450-527x245_3939a63bbb.pngThe InSight® 3DAFM was designed specifically to address CD, depth and CMP metrology in a production environment. It provides the unparalleled accuracy and precision required for non-destructive, high-resolution 3D measurements of critical semiconductor features. The system enables an entirely new approach to in-line 3D metrology, delivering both unique 3D Metrology (LWR, LER) and the lowest measurement uncertainty for CD, Depth and Sidewall Angle on critical layers, such as Shallow Trench Isolation, Gate and FinFet structures. These features allow the system to overcome the limitations of CD-SEM and Optical CD technologies, which suffer from bias variation issues that negatively impact CD measurements.

csm_Dimension-AFP_527x245_67c80e3a0f.pngThe Dimension AFP (DAFP) is the world’s only fab-based metrology tool specifically designed for both CMP profiling and etch depth metrology for current and advanced technology nodes. The system combines the superb resolution of an AFM with the long-scan capability of an atomic force profiler to monitor etch depth and dishing and erosion on submicron features with unsurpassed repeatability. Replacing costly wafer cross-sectioning, the Dimension AFP offers the highest performance available for device characterization.


d8fabline u_hr-xrd.pngThe Bruker D8 FABLINE is the fully automated X-ray metrology tool for the semiconductor industry, with applications in the front - and back end of the process line and packaging. Whether for R&D purposes or production quality control, the D8 FABLINE offers fast, non-destructive, high precision thin film analysis on blanket or structured wafers. The D8 FABLINE is tailored for your applications and needs. In HRXRD configuration, it offers thickness, composition and strain analysis on epitaxial layers. It may come in XRR mode that enables the thickness, density and roughness determination of thin-multi-layers. A µ-XRF module is offered for composition and thickness analysis on metal filmstacks. A combination of several applications is possible as well.

d8discover for fa lab.pngThe Bruker D8 DISCOVER for FA Lab is an advanced X-Ray Diffraction System for materials research applications. The D8 DISCOVER with DAVINCI design increases ease-of-use with real-time component detection, plug-and-play functionality and fully integrated 2-dimensional XRD2 capabilities. These unique features allow the user to easily switch between all materials research X-ray diffraction applications, including reflectometry, high-resolution diffraction, in-plane grazing incidence diffraction (IP-GID), small angle X-ray scattering (SAXS), as well as residual stress and texture investigations.

s8 fabline txr.pngThe Bruker S8 FABLINE-TXRF is the tool for monitoring trace metal contamination on the wafer surface by TXRF (Total Reflection X-Ray Fluorescence). It has full mapping capability with 0 mm edge exclusion measurement. It contains multiple X-ray sources for the optimized excitation for light, medium and heavy elements. The intuitive user interface (PTO) assures failsafe operation of the tool. The full automatic wafer handling accepts wafers of 300 mm and 450 mm. Furthermore, the system is SEMI S2, S8 and CE compliant.

 X-RAY Metrology Bruker-JV

The Bruker-JV Series (former Jordan Valley) consists of several tools for a broad spectrum of applications in both metals, WPS and device thin film and defects and CD metrology market.

JVX6200iRF: Bruker's JVX6200iRF features a multi-channel metrology platform with small spot XRF and Fast XRR channels, for measurement of thin metal layer stacks on product or blanket wafers. The tool is designed for advanced process control of metals and transparent films  at the back-end of line (BEOL), MEOL and front end of line (FEOL)  of advanced semiconductors processes (Logic, DRAM, Flash and HDD process lines).

jvx6200.pngJVX6200iF: The Bruker-JVX 6200iF Galaxy as a small spot XRF is the tool of record for single bump composition measurements. It is an XRF tool that is ideal for non-destructive, in-line µ-bump %Ag measurements. The system has a vertical excitation geometry that allows smallest beam footprint (<20µm FWHM @SnKα and AgKα) and no dependence on height variation. The tool provides information critical for good wafer level packaging process control. The JVX 6200iF comes with nEXT software which includes fully automated recipe driven measurements, FP analysis and advanced navigation algorithms allowing sub-micron centralization on single bump.

JVX7300F: The JVX7300F is the latest generation X-ray Fluorescence (XRF) tool from Bruker. It includes all features of the JVX6200iF, which is the tool of record at many fabs, and extends the metrology capabilities for advanced micro-bump and Under Bump Metallization (UBM) processes. The JVX7300F allows the non-destructive thickness, and composition measurement,  of smaller features than previous generations of XRF tools with enhanced productivity, improved ease-of-use and maintainability.

jvx7300hr.pngJVX7300HR: The JVX7300HR extends the capabilities of previous High-Resolution X-ray Diffraction (HRXRD) and X-ray Reflectivity (XRR) platforms to meet advanced node challenges. JVX7300HR delivers full stack analysis with higher throughput, smaller feature dimensions, and improved tool-to-tool matching, as well as enhanced user interface, ease-of-use and lower cost of ownership (COO). The Bruker-JVX7300HR is a state of the art X-ray metrology platform, targeting the most advanced technology nodes and challenging processes, mainly of FEOL applications:

JVX7300LSI: The JVX7300LSI was designed for in-fab R&D and in-line production process monitoring of semiconductors materials. It enables fully automated characterisation of many advanced materials in the semiconductor industry. The system provides scanning HRXRD, XRR, WA-XRD for sub 20nm Si logic R&D, process development and production process monitoring on blanket and patterned wafers. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention, even within the same recipe batch. Full automation of the alignment, measurement, analysis and reporting of the results ensures productive and fast characterisation of thin films. The standard configuration is the JVX7300L, which implements Scanning HRXRD, XRR, XRD, GI-XRD and WA-XRD. To allow in-plane XRD measurements, the optional I channel can be added. For HRXRD of patterned structures, the M channel can be added (JVX7300LMI). This allows the measurement of test structures on patterned wafers, with full pattern recognition. The optional S channel is specifically designed for HRXRD of standard and advanced epitaxy on metrology pads (<100µm pads), e.g. LED or power transistor applications.

jvsensus-600e.pngJVSensus-600E: The JVSensus is the latest defect metrology system for Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra-fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.

For further details please contact merconics or visit the Bruker Website: